Sharp Interpack has taken a significant step towards eliminating the impact that its packaging has on the environment with the launch of its c-Low mushroom punnet.
The c-Low punnet represents a reduction in virgin petro-chemical content, making it one of the lowest carbon footprint punnets available on the market today.
The carbon footprint of the punnet is 23 per cent lower than conventional PP materials, combining a naturally resourced mineral filler blended with UK post-consumer waste.
The c-Low punnet has been manufactured with a rib design to maximise strength and ensure the contents are protected during transit. With a ‘non-plastic’ appearance, however, it is tactile and soft to the touch. c-Low has been designed for heat sealing with a permanent or peelable film and will be available across a range in variable depths.
Tony Manners, sales director for Sharp Interpack in Yate, said: “We have an ongoing commitment to reduce the environmental impact of our packaging products and by delivering recycled packaging, we are pleased to be meeting this commitment. c-Low represents a breakthrough in materials technology and the new design has been created for the rigours of modern packing systems.”
The c-Low punnet will be launched at Fruit Logistica in Berlin.
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